Beijing Technol Science Co., Ltd.
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  • Contact Person : Mr. Peng Robert
  • Company Name : Beijing Technol Science Co., Ltd.
  • Tel : 86-10-62714351
  • Fax : 86-10-62711482
  • Address : Beijing,beijing,Room1108 jingyanlong mansion jingbangyuan district xisanqi bridge north haidian beijing china
  • Country/Region : China
  • Zip : 100096

HF-450 Hot-filament Chemical Vapor Deposition System

HF-450 Hot-filament Chemical Vapor Deposition System
Product Detailed
Related Categories:Metal Coating Machinery

Detailed Product Description


functions

HF-450 Hot-filament Chemical Vapor Deposition System operate on the basis of hot-filament chemical vapor deposition technique, and can be used to deposit thick diamond films, silicon nitride films, and silicon dioxide films, etc. They are extremely suitable for industrial production and have been implemented on the product lines of a lot of well-known companies. Using our equipments, these companies have already produced sheet-like polycrystalline diamond wafers with large dimensions and realized considerable economic benefits from these products. In addition, our equipments are      also very suitable for scientific research and education and for the large-scale development of new commercial products.

Type

Type A

Type B

Type C

Dimension of the sputtering chamber

Φ450×H450mm

Φ650×H770mm

Φ800×H800mm

Dimension of the Substrate platform

Φ150×H44mm

Φ200×H44mm

Φ300×H44mm

Height of the Substrate platform

200?150mm

200?150mm

200?150mm

Rotation rate of the Substrate platform

0-20 rpm (adjustable)

0-20 rpm (adjustable)

0-20 rpm (adjustable)

Electrode size

Φ24×200mm

Φ24×200mm

Φ24×200mm

Current across the electrode

> 300 A

> 300 A

> 300 A

Oxidation resistance of the materials

Atmospheric oxidation resistance

Atmospheric oxidation resistance

Atmospheric oxidation resistance

Film types

Thick diamond films

Thick diamond films

Thick diamond films

Power supply

Hot-wire power supply

Hot-wire power supply

Hot-wire power supply

Structure of the vacuum chamber

Pre-open vertical structures, Postposition pumping systems, Double-layer water cooling

Highest attained vacuum

1.0×10-3 Pa

Vacuum pumps

Diffusion pump + Roots pumps + mechanical pump + process pump

Pumping speed

Pumping time≤30 min, from atmospheric pressure to 10-3Pa

Film uniformity

The fluctuations of the film thickness are less than 5%

Vacuum measurement

Two low, one high digital composite vacuum gauges, Film thickness gauges

Vacuum control

Manual control or automatic control

Gas flow control

Three Road gas flow control and the corresponding display systems

Protection

Alarm and automatic protection function for water depletion, abnormal flow, over current flowing, over voltage, and electrical shutdown, etc.

Basic parameters

Power≥15KW; Weight: 500kg; Served area: 8m2

Optional devices

Deionized water cooling & recycling machine, PLC control, the entire manual control, semi-automatic control

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